Round magnetrons

    Round magnetrons are designed for efficient sputtering of targets made of conductive materials by ion bombardment. Ions are provided by plasma of an abnormal cross-field glow discharge. In DC mode of operation magnetrons allow to sputter conductive metals and alloys, both conductive and nonconductive. In Pulsed DC mode of operation sputtering of semiconductors and reactive sputter deposition is possible. An RF mode of operation is used for sputtering of dielectric targets.

    We own a special know-how technology of ultra high rate deposition called TEMD (Thermal Evaporation in Magnetron Discharge), that allow to deposit metals at rates up to 50 um/min. Unlike Arc-PVD this technology does not produce droplets on a target's surface.

    Processes:

    • Magnetron sputtering of metals and alloys retaining the original composition;

    • thermal evaporation in a magnetron discharge;

    • reactive evaporation of dielectrics.

    Installation: on a sliding seal, on a flange (KF, CF, ISO). 

    Parameter

    D100

    Maximal operating voltage, V

    1600

    Operation pressure, Pa

    0.07..10

    Target shape

    round

    Maximum target thickness, mm

    10

    Target diameter, mm

    95..100

    Maximal power, W

    6000

    Weight, kg

    2.6