Next processes are implemented in machines NIKA for microelectronics:
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Sputtering of thick aluminum on the power devices (up to 30 microns).
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Sputtering of titanium-nickel-silver on the rear part of the devices (for solder).
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High-precision etching of LED devices based on gallium nitride with laser depth control.
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Deposition of thin layers of gold-nickel for the spreading of the charge on the LED devices.
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High-precision etching of epitaxial structures of semiconductor lasers with laser depth control and manageable profile of etching.
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And many others.