Next processes are implemented in machines NIKA for microelectronics:

    • Sputtering of thick aluminum on the power devices (up to 30 microns).

    • Sputtering of titanium-nickel-silver on the rear part of the devices (for solder).

    • High-precision etching of LED devices based on gallium nitride with laser depth control.

    • Deposition of thin layers of gold-nickel for the spreading of the charge on the LED devices.

    • High-precision etching of epitaxial structures of semiconductor lasers with laser depth control and manageable profile of etching.

    • And many others.

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