Next processes are implemented in machines NIKA for microelectronics:

• Sputtering of thick aluminum on the power devices (up to 30 microns).

• Sputtering of titanium-nickel-silver on the rear part of the devices (for solder).

• High-precision etching of LED devices based on gallium nitride with laser depth control.

• Deposition of thin layers of gold-nickel for the spreading of the charge on the LED devices.

• High-precision etching of epitaxial structures of semiconductor lasers with laser depth control and manageable profile of etching.

• And many others.